New Thermal Management

Würth Elektronik Heat Sink Solutions
Würth Elektronik Heat Sink Solutions are designed to provide effective thermal management to improve performance, reduce system failure, and increase the lifespans of electronics. These high-performance heatsink solutions include WE-HIC and WE-HICI heatsinks for ICs, WE-HTO and WE-HTOI heatsinks for transistors, and WE-TMA accessories for mounting the heatsinks and transistors. The WE-HIC are standard heatsinks, while the WE-HICI are heatsinks with pre-applied thermal interface material. These heatsinks for ICs are available in unidirectional and bidirectional variants in four different sizes. The WE-HTO are standard heatsinks, while the WE-HTOI are heatsinks with pre-applied thermal interface material. These heatsinks for transistors are designed specifically for TO-220 and TO-247 packages. The transistor heatsinks are constructed from black-anodized aluminum and available in four types, including simple, curved, clip-on, and extruded. Applications include Ball Grid Array (BGA), Pin Grid Array (PGA), CPU, DC/DC converter, and microcontrollers.